| 摘要 |
PROBLEM TO BE SOLVED: To provide plasma etching equipment capable of enhancing uniformity of plasma density.SOLUTION: Plasma etching equipment includes an antenna group 20 including three or more high-frequency antennas concentrically arranged, and a high-frequency power supply RF2 for supplying high-frequency power to the antenna group. The antenna group 20 includes a plurality of forward-direction antennas 21 and 23 connected to the high-frequency power supply RF2 so that flowing directions of currents are the same, and a reverse-direction antenna 22 connected to the high-frequency power supply RF2 so that a direction of a current is reverse to those of the forward-direction antennas. The high-frequency antenna 21 adjacent to the reverse-direction antenna 22 outside the reverse-direction antenna 22 and the high-frequency antenna 23 adjacent to the reverse-direction antenna 22 inside the reverse-direction antenna 22 are the forward-direction antennas 21 and 23, respectively. |
