发明名称 |
CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL |
摘要 |
A conductive silver via paste comprising particulate conductive silver, a lead-tellurium-lithium-titanium-oxide, titanium resinate and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.
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申请公布号 |
US2013186463(A1) |
申请公布日期 |
2013.07.25 |
申请号 |
US201213693202 |
申请日期 |
2012.12.04 |
申请人 |
E I DU PONT DE NEMOURS AND COMPANY;E I DU PONT DE NEMOURS AND COMPANY |
发明人 |
WANG YUELI;HANG KENNETH WARREN |
分类号 |
H01L31/0272;H01L31/0224 |
主分类号 |
H01L31/0272 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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