| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting substrate capable of suppressing generation of voids in an electrode of a semiconductor element due to electromigration, and to provide a semiconductor device and a method for manufacturing the semiconductor device.SOLUTION: A mounting substrate 9 includes: a connection pad 2 mainly composed of copper and provided in a mounting part 1a of an insulating substrate 1; a solder bump 3 provided on the connection pad 2. Copper particles 4 coated with a metal layer 5 made of at least one metal material selected from nickel, iron, cobalt, platinum, and palladium are added to the solder bump 3. Since an electrode can be coated with a copper-tin alloy formed by a copper component of the copper particles 4, voids of the electrode due to electromigration are suppressed. |
