| 摘要 |
The disclosure discloses an electronic device including an electronic component including a chip main body, a plurality of electrodes, a passivation which includes openings, and UBMs which are respectively formed to be smaller than an opening area of the opening, a substrate including a plurality of substrate electrodes, and a plurality of spherical solder bumps configured to electrically connect the plurality of electrodes with the plurality of substrate electrodes. The solder bump is bonded to the electrode at a bonding portion located on a bottom surface of the spherical shape. Each of the plurality of electrodes includes an exposed portion generated because a bonding area between the solder bump and the electrode via the UBM is smaller than the opening area. The solder bump is separated apart from the passivation via an upper space located above the exposed portion of the electrode.
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