发明名称 |
ULTRASONIC TRANSDUCER ELEMENT CHIP, PROBE, ELECTRONIC APPARATUS AND ULTRASONIC DIAGNOSTIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thin-type ultrasonic transducer element chip having sufficient strength in a thickness direction of a substrate.SOLUTION: A plurality of openings 45 is disposed in an array on a substrate 21. The plurality of openings 45 are separated from one another by partition walls 51. An ultrasonic transducer element 23 is provided for each of the plurality of openings 45. A plate-like member 52 is fixed to a rear surface of the substrate 21. A thickness t of each of the partition walls 51 is smaller in comparison with a wall height H of each of the partition walls 51. |
申请公布号 |
JP2013175879(A) |
申请公布日期 |
2013.09.05 |
申请号 |
JP20120038402 |
申请日期 |
2012.02.24 |
申请人 |
SEIKO EPSON CORP |
发明人 |
NAKAMURA TOMOSUKE;TSURUNO JIRO;KIYOSE SETSUNAI |
分类号 |
H04R17/00;A61B8/00 |
主分类号 |
H04R17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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