| 摘要 |
PROBLEM TO BE SOLVED: To provide an iron base circuit board capable of improving heat dissipation properties while using a steel plate for a metal substrate.SOLUTION: On an iron base circuit board 1, a wiring pattern 7 is formed on one side surface 3a of an iron substrate 3 via an insulation layer 5. The thickness of the iron substrate 3 is set within the range of 0.3 to 1.0 mm in consideration of the output wattage of LED lighting. By means of the iron substrate 3, generation of cracks in the insulation layer 5 is suppressed, high stiffness is obtained, and warpage is hard to occur in stamping or the like. A heat sink can be precisely attached while maintaining flatness. Heat dissipation properties of the iron base circuit board can be set in accordance with the output wattage of the LED lighting to thus obtain appropriate heat dissipation properties. |
