发明名称 SURFACE TREATING AGENT OF COPPER OR COPPER ALLOY AND USE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a surface treating agent and a surface treatment method which enable a chemical conversion coating film having excellent oxidation resistance and corrosion resistance to be formed on a surface of copper or copper alloy, and to provide a film substrate or a glass substrate in which the chemical conversion coating film is formed on the surface of copper or copper alloy by bringing the surface treating agent into contact with the surface of copper or copper alloy, and a transparent electrode substrate in which the film substrate or the glass substrate is affixed to an insulator layer with transparent self-adhesive.SOLUTION: This surface treating agent for copper or copper alloy is used, which contains tetrazole compound expressed by chemical formula (I) and/or its salt, and ammonium. In the formula, R denotes an alkyl group or a cyclopropyl group of carbon number 1-3.
申请公布号 JP2013189683(A) 申请公布日期 2013.09.26
申请号 JP20120056672 申请日期 2012.03.14
申请人 SHIKOKU CHEM CORP 发明人 IIDA SOSAKU;MURAI TAKAYUKI;HIRAO HIROHIKO
分类号 C23C22/63;H05K3/28 主分类号 C23C22/63
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