发明名称 |
ORGANIC ELECTRONIC PACKAGES HAVING HERMETICALLY SEALED EDGES AND METHODS OF MANUFACTURING SUCH PACKAGES |
摘要 |
Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.
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申请公布号 |
US2013248828(A1) |
申请公布日期 |
2013.09.26 |
申请号 |
US201313801505 |
申请日期 |
2013.03.13 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
SCHAEPKENS MARC;DUGGAL ANIL R.;HELLER CHRISTIAN MARIA ANTON |
分类号 |
H01L51/52;H01L51/00;H05B33/04 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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