发明名称 Thermal Management of Molding System
摘要 A system (100), including: a computer-usable medium (102) embodying a set of instructions (106) being executable by a computer (120), the computer (120) being configured to be connected with and to control a grouping of thermal-management assemblies (142) being associated with respective thermal-management of a molding system (140), the set of instructions (106) including computer-executable instructions for directing the computer (120) to perform, in use, a collection of operations, the collection of operations including: a thermal-management operation (S101), including: management of application of power to the grouping of thermal-management assemblies (142) of the molding system (140).
申请公布号 US2013253696(A1) 申请公布日期 2013.09.26
申请号 US201113991440 申请日期 2011.11.16
申请人 ESSER BRIAN;HUSKY INJECTION MOLDING SYSTEMS LTD. 发明人 ESSER BRIAN
分类号 G01K1/02 主分类号 G01K1/02
代理机构 代理人
主权项
地址