| 摘要 |
There is provided a high-temperature Zn-based Pb free solder alloy having a melting point of approximately 300 to 400° C. and is excellent in wettability, joinability, workability and reliability. The Pb-free solder alloy mainly containing Zn consists of: 1.0 to 9.0 mass %, preferably 3.0 to 7.0 mass % of Al, 0.002 to 0.800 mass %, preferably 0.005 to 0.500 mass % of P, and a balance being Zn except for inevitable impurities incorporated during a manufacturing stage. The Pb-free solder alloy may include at least one of 0.3 to 4.0 mass % of Mg or 0.3 to 3.0 mass % of Ge.
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