| 摘要 |
A substrate bonding apparatus is provided to attenuate the strength applied to a frame and a lifting screw by providing a shock-absorbing member between an upper chamber and a lower chamber so that the load of a lifting device can be minimized when vacuum exhaustion is performed. A substrate bonding apparatus comprises an upper chamber(200), a lower chamber(300), and a shock-absorbing member(600). The upper chamber mounts an upper substrate. The lower chamber mounts a lower substrate to be bonded with the upper substrate. Combined with the upper chamber, the lower chamber forms a bonding space. The shock-absorbing member is located between the upper chamber and the lower chamber. When the vacuum exhaustion of the bonding space is performed, the shock-absorbing member absorbs the shock between the two chambers and supports them. |
