| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device, which has excellent peelability.SOLUTION: An adhesive sheet 10 for manufacturing a semiconductor device includes a base material and an adhesive layer including a fluorine-containing additive provided on one surface of the base material, and is detachably attached to a lead frame 20 or a wiring board of the semiconductor device. The adhesive layer has surface fluorine recovery calculated by the following formula (1) is 70% and more: surface fluorine recovery (%)=surface fluorine content rate α after recovery÷initial surface fluorine content rate &bgr;×100 (1). |
