发明名称 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die |
摘要 |
A coating for a microelectronic device comprises a polymer film (131) containing a filler material (232). The polymer film has a thermal conductivity greater than 3 W/m·K and a thickness (133) that does not exceed 10 micrometers. The polymer film may be combined with a dicing tape (310) to form a treatment (300) that simplifies a manufacturing process for a microelectronic package (100) and may be used in order to manage a thermal profile of the microelectronic device.
|
申请公布号 |
US8569108(B2) |
申请公布日期 |
2013.10.29 |
申请号 |
US201213613650 |
申请日期 |
2012.09.13 |
申请人 |
XU DINGYING;ARANA LEONEL R.;RARAVIKAR NACHIKET R.;MAMODIA MOHIT;SWAMINATHAN RAJASEKARAN;MANEPALLI RAHUL;INTEL CORPORATION |
发明人 |
XU DINGYING;ARANA LEONEL R.;RARAVIKAR NACHIKET R.;MAMODIA MOHIT;SWAMINATHAN RAJASEKARAN;MANEPALLI RAHUL |
分类号 |
H01L21/78;B32B27/00 |
主分类号 |
H01L21/78 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|