发明名称 YOUNG'S MODULUS MEASURING METHOD OF ABRASIVE GRAIN OF CHEMICAL MECHANICAL POLISHING SLURRY
摘要 PROBLEM TO BE SOLVED: To provide a method for quickly measuring a Young's modulus of an abrasive grain of chemical mechanical polishing slurry.SOLUTION: A Young's modulus measuring method of an abrasive grain of chemical mechanical polishing slurry comprises the steps of: fixing a plurality of abrasive grains powders to a sample stand by adhesive agents; setting the sample stand to a scanner of an atomic force microscope comprising a cantilever having a predetermined spring constant and a probe; setting a plurality of probe positions with respect to the probe; repeating contact and release of the probe with and from respective abrasive grains so as to correspond to the plurality of probe positions set; generating a force curve measured by the atomic force microscope by the contact and the release of the probe; converting a vertical axis to force and a horizontal axis to a deformation depth and graphing a positional relation between the force and the probe by using a Young's modulus calculation software; and obtaining a Young's modulus of each abrasive grain from the positional relation between the force and the probe.
申请公布号 JP2013217694(A) 申请公布日期 2013.10.24
申请号 JP20120086305 申请日期 2012.04.05
申请人 HITACHI CHEMICAL CO LTD 发明人 HONBO MICHIKO;ENOMOTO KAZUHIRO;YOSHIKAWA SHIGERU;OTA MUNEHIRO
分类号 G01Q60/24;B24B37/00;C09K3/14;G01N3/40;H01L21/304 主分类号 G01Q60/24
代理机构 代理人
主权项
地址