| 摘要 |
<p>A laminating apparatus is provided which causes a resin film to completely conform to protruding and recessed portions of a substrate, and which makes the film thickness of the conforming resin film uniform on a stricter level. To this end, as shown in FIG. 19 , the laminating apparatus includes a laminating mechanism (E1) including: an enclosed space forming means capable of receiving a provisionally laminated body (PL1) therein; andapressurelaminatingmeans (P1) for applying pressure to the provisionally laminated body (PL1) in non-contacting relationship in an enclosed space formed by the enclosed space forming means to form an end laminated body from the provisionally laminated body (PL1).</p> |
