发明名称 FIXING STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To fix by press-fitting an electronic component while suppressing damage using a pair of heat radiation members and a pinching member having an L-shaped cross section.SOLUTION: Two or more heating exothermic components 2 mounted straight on a circuit board 3 are pinched with a pair of heat radiation members 1 and a pinching member 4 having an L-shaped cross section and screwed for press-fitting and fixing. As the heat radiation member 1, a member is used in which a guide groove 11 extending in the straight direction is formed on a peripheral edge part that is flat plate like extending in the straight direction with one end surface hooking on one side surface 1a of respective exothermic components 2, and protrudes in the height direction side of the exothermic component 2. As the pinching member 4, a member having an L-shaped cross section is used which is equipped with a pinching part 43 containing a peripheral part that is flat plate like extending in the straight direction with one end surface 43a hooked on a rear surface side surface 2b of the respective exothermic components 2, protrudes in the height direction side of the exothermic component 2, and a protruding part 44 that is flat-plate like extending in the direction of the heat radiation member 1 side from the protruding peripheral edge part, with a tip end edge surface 42 side loosely inserted in the guide groove 11, with a play present in depth direction of the guide groove 11.
申请公布号 JP2013229366(A) 申请公布日期 2013.11.07
申请号 JP20120098615 申请日期 2012.04.24
申请人 MEIDENSHA CORP 发明人 NISHIZAWA YASUHIRO
分类号 H05K7/20;H01L23/36;H01L23/40 主分类号 H05K7/20
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