| 摘要 |
PROBLEM TO BE SOLVED: To secure good conductivity between conductive layers and improve the insulation performance to a metal case.SOLUTION: A circuit board includes: an insulation substrate 2 where a through hole 3 allowing a first surface 2a, on which an electronic component 6 is mounted, to communicate with a second surface 2b on the opposite side of the first surface is formed; a first surface side conductive layer 4 formed from the first surface to the through hole and having electrical continuity with the electronic component; a second surface side conductive layer 5 formed from the second surface to the through hole and having electrical continuity with the first surface side conductive layer in the through hole; a resistance layer 8 formed on the second surface and having electrical continuity with the second surface side conductive layer; a second surface side lamination conductive layer 10 which is formed from the second surface to the through hole, covers the second surface side conductive layer, and closes at least a part of the through hole; a second surface side protection glass layer 12 covering the second surface side conductive layer, the second surface side lamination conductive layer, and the resistance layer; and an adhesive layer 14 formed between the second surface side protection glass layer and an inner surface of a metal case 63. |
