发明名称 METHODS OF TREATING A MOLD AND FORMING A SOLID LAYER OF A SEMICONDUCTING MATERIAL THEREON
摘要 A method of forming a solid layer of a semiconducting material on an external surface of a treated mold which extends between a leading edge and a trailing edge comprises selectively modifying a temperature gradient of a mold such that a temperature of the leading edge (T1) is less than a temperature of the trailing edge (T2) to form the treated mold. The method further comprises submersing the treated mold into a molten semiconducting material such that the leading edge of the treated mold is first submersed into the molten semiconducting material. The method also comprises withdrawing the treated mold from the molten semiconducting material to form the solid layer of the semiconducting material on the external surface of the treated mold.
申请公布号 US2013300025(A1) 申请公布日期 2013.11.14
申请号 US201313841773 申请日期 2013.03.15
申请人 CORNING INCORPORATED 发明人 COOK GLEN BENNETT;MAZUMDER PRANTIK;SINGH JOHN PAUL BIR
分类号 B29C33/56 主分类号 B29C33/56
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