| 摘要 |
A ring adhesive tape having an annular adhesive layer in a peripheral area thereof is attached to the front side of a wafer having a device area and a peripheral area surrounding the device area. The annular adhesive layer of the ring adhesive tape is positioned so as to correspond to the peripheral marginal area of the wafer, so that the annular adhesive layer does not adhere to the device area. In peeling the ring adhesive tape from the front side of the wafer after forming modified layers inside the wafer, it is possible to prevent damage to the device area due to the adhesive force of the annular adhesive layer.
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