| 摘要 |
PROBLEM TO BE SOLVED: To make it possible for a semiconductor device to cope with higher speed signal communication.SOLUTION: A microcomputer chip 1 is mounted on a package board 3, and an inner pad 1e of the microcomputer chip 1 arranged around an opening 1c is electrically connected with a terminal of the package board 3 in the vicinity via the opening 1c formed by drilling a hole from a main surface 1a to a rear surface 1b of the microcomputer chip 1. This allows the number of electrode pads of the microcomputer chip 1 to be increased without making the chip size large, and allows a semiconductor device to cope with a higher speed signal by reducing the loss of signal communication at a ball grid array (BGA) 6. |
