| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which meets a demand for improving electric reliability of a mounting structure.SOLUTION: A wiring board 3 of this invention includes: an insulation layer 6 in which a groove T opening on one surface is formed; and a conductive layer 7 positioned in the groove T. The insulation layer 6 includes: an inorganic porous layer 9 including multiple first inorganic insulation particles 11 which are connected with each other at parts thereof, the inorganic porous layer 9 where multiple gaps G formed by being enclosed by the multiple first inorganic insulation particles 11 are formed; and a resin 10 filling the gaps G. As a result, the structure reduces a thermal expansion coefficient of the wiring board 3, improves the connection reliability between the wiring board 3 and the electronic component 2, and improves the electric reliability of a mounting structure 1. |
