| 摘要 |
A substrate holding apparatus is used for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing and planarizing the substrate. The substrate holding apparatus includes an elastic membrane, a top ring body for holding the elastic membrane, and a plurality of pressure chambers partitioned by at least one partition wall of the elastic membrane. The substrate is held by a lower surface of the elastic membrane and pressed against the polishing surface with a fluid pressure by supplying a pressurized fluid to the pressure chambers. The substrate holding apparatus further include a stopper configured to limit the inflation of the elastic membrane by being brought into contact with a part of the partition wall of the elastic membrane or an extending member extending from a rear surface of the elastic membrane whose surface serves as a substrate holding surface. |
