发明名称 THICKNESS MONITORING DEVICE, ETCHING DEPTH MONITORING DEVICE, AND THICKNESS MONITORING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a thickness monitoring device which can perform thickness measurement on a measurement object in real time even when a relatively narrowband light source is used.SOLUTION: An etching monitoring device (thickness monitoring device) 100 includes: a light source 1 generating a measuring beam having a predetermined wavelength width; an array detector 32 detecting interference light of the measuring beam reflected by a mask whose thickness varies with time for each wavelength; and a data processor 4 calculating a thickness of the mask on the basis of a time variation of a plurality of single-wavelength components of the interference light detected by the array detector 32.
申请公布号 JP2014002068(A) 申请公布日期 2014.01.09
申请号 JP20120138086 申请日期 2012.06.19
申请人 SHIMADZU CORP 发明人 GOTO HIROOMI;NAGUMO YUZO;KATO RUI
分类号 G01B11/06 主分类号 G01B11/06
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