发明名称 |
THICKNESS MONITORING DEVICE, ETCHING DEPTH MONITORING DEVICE, AND THICKNESS MONITORING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a thickness monitoring device which can perform thickness measurement on a measurement object in real time even when a relatively narrowband light source is used.SOLUTION: An etching monitoring device (thickness monitoring device) 100 includes: a light source 1 generating a measuring beam having a predetermined wavelength width; an array detector 32 detecting interference light of the measuring beam reflected by a mask whose thickness varies with time for each wavelength; and a data processor 4 calculating a thickness of the mask on the basis of a time variation of a plurality of single-wavelength components of the interference light detected by the array detector 32. |
申请公布号 |
JP2014002068(A) |
申请公布日期 |
2014.01.09 |
申请号 |
JP20120138086 |
申请日期 |
2012.06.19 |
申请人 |
SHIMADZU CORP |
发明人 |
GOTO HIROOMI;NAGUMO YUZO;KATO RUI |
分类号 |
G01B11/06 |
主分类号 |
G01B11/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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