| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board facilitating accommodation of an electronic component into a through hole, and a method for manufacturing the wiring board.SOLUTION: The wiring board includes a core layer, a through hole penetrating through the core layer in the thickness direction, and an electronic component accommodated in the through hole. The through hole includes an inwardly projecting part where an inner wall face projects inwardly, in a plane view, from an opening on one face side of the core layer and an opening on the other face side of the core layer. The electronic component is held by the inwardly projecting part. |
