| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting type device which connects a base substrate and a main substrate with each other by using a pin adopter where multiple pins are integrally formed and enables automatic mounting, which enables reflow of solder connection, improves the design flexibility, and meets customer's demands.SOLUTION: In a surface mounting type device, a pin adopter 5, in which multiple pins 6 are integrally formed, is mounted on a base substrate 1, and tips of the pins 6 are inserted into holes formed at positions of a main substrate 2, which correspond to the pins 6, to connect the base substrate 1 with the main substrate 2. A leg portion of each pin 6 of the pin adopter 5 is folded inward, and opening parts 52, 53 are formed in the leg portion. |
