发明名称 MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer substrate and an electronic device which can avoid defects such as conductor discontinuity caused by positional deviation in the multilayer substrate incorporating longitudinal conductors and transverse conductors; and which allows formation of a continuous conductor without causing a cavity, a clearance and the like.SOLUTION: Substrates 11-13 include longitudinal conductors 21-23 filled inside vertical holes 31-33, respectively, which extend in a thickness direction. Adjacent first substrate 11 and second substrate 12 include a transverse lateral conductor 41 which is connected to the vertical conductors 21, 22 between opposite surfaces opposite to each other of the first substrate 11 and the second substrate 12. The transverse conductor 41 is filled inside a space 51 formed between the opposite surfaces. One end of at least one of the first vertical hole 31 of the first substrate 11 and the second vertical hole 32 of the second substrate 12 opens in a plane of the space 51 leaving clearances &Dgr;X1, &Dgr;Y1 and &Dgr;Y12 between itself and an inner edge of the space 51. The space 51 is provided between the opposite surfaces and defined by an intermediate layer 61 bonded to the opposite surfaces.
申请公布号 JP2014003272(A) 申请公布日期 2014.01.09
申请号 JP20130035941 申请日期 2013.02.26
申请人 NAPURA:KK 发明人 SEKINE SHIGENOBU;SEKINE YURINA
分类号 H01L23/32;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/32
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