| 摘要 |
PROBLEM TO BE SOLVED: To realize a thin shape of an apparatus.SOLUTION: A circuit board according to one embodiment includes: a substrate having a pad; a component having a mounting surface facing the substrate; and a joining member located over a side surface of the component and a part of the pad. The pad includes a first pad part and a second pad part which is positioned closer to the center side of the component relative to the first pad part. The joining member is applied to an area deviated from an area between the mounting surface and the substrate and has a shape which spreads along a recessed part formed between the first pad part and the second pad part as the component is mounted. |
