| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal type flowmeter that includes a circuit package having an arrangement structure in which molding resin can be filled into every corner of a cavity while preventing resin leakage from occurring.SOLUTION: A thermal type flowmeter comprises a circuit package 400 in which a temperature detection element 518, a flow rate detection part 602, and circuit components 516, 604 are mounted on a lead frame 511 and are sealed with a molding resin. The circuit package 400 includes: a body part 404 on which the circuit components 516, 604 are mounted; a first package protrusion 401 on which the temperature detection element 518 is mounted; and a second package protrusion 402 on which the flow rate detection part 602 is mounted. The body part 404 is provided with an inlet part 405 into which a molding resin is filled, and the inlet part 405 is arranged in a position facing the first package protrusion 401 and the second package protrusion 402 through the circuit components 516, 604. |
