| 摘要 |
PROBLEM TO BE SOLVED: To provide an LED module capable of increasing the heat dissipation and capable of a high light outputting.SOLUTION: An LED module 1 includes: a mounting substrate 2; a heat transfer part 20 on which LED chips 3 are mounted on one side thereof; and a wiring pattern 22 disposed at the opposite side of the heat transfer part 20 and electrically connected to the LED chips 3 via wires 26. The heat transfer part 20 includes through holes 20b formed therein for allowing each wire 26 to pass therethrough. The LED module 1 includes a first sealing part 36 sealing the LED chips 3 on the one side of the heat transfer part 20; and a second sealing part 38 sealing a part of each wire 26 between the first sealing part 36 and the through hole 20b. The first sealing part 36 includes a fluorescent substance that emits light of a wavelength longer than that from the LED chips 3 being excited by the light emitted from the LED chips 3 and a first transparent material. The second sealing part 38 is composed of a second transparent material. |
