发明名称 HOUSING AND MOLD
摘要 PROBLEM TO BE SOLVED: To reduce the thickness and weight of a housing using a resin while suppressing the deterioration of rigidity, and to suppress the temperature rise of the housing.SOLUTION: In a housing 3 having a thin plate part 4 formed of a resin, honeycomb projections 6 which form a honeycomb structure arranged with a plurality of hexagonal cells 7 are formed on the internal surface 4a of the thin plate part 4. The plate thickness A of the thin plate part 4 is 1.5 mm or less, the diameter B of an inscribed circle of the hexagonal cell 7 is 5,000 μm or less, and the width D of one side of the honeycomb projection 6 is 500 μm or less. A heat generating member, such as a secondary battery, is supported by the honeycomb projections 6 in a line-contact manner to form a heat insulation air layer between the heat generating member and the housing 3, whereby heat conduction from the heat generation member to the housing 3 can be suppressed to a very small level. As a result, the temperature rise of the housing 3 can be suppressed.
申请公布号 JP2014004761(A) 申请公布日期 2014.01.16
申请号 JP20120141974 申请日期 2012.06.25
申请人 ASAHI KASEI CHEMICALS CORP 发明人 WATANABE MASAKI
分类号 B29C33/42;B29C33/38;B29L31/34 主分类号 B29C33/42
代理机构 代理人
主权项
地址