| 摘要 |
PROBLEM TO BE SOLVED: To resolve a problem in which further increase in density and performance of a semiconductor device to be mounted on an information device may cause that even an inductance component of a plating through hole penetrating through a core layer of a build-up substrate of the semiconductor device becomes a primary factor in increase of noise, and to provide a highly-reliable mounting structure for a semiconductor device capable of reducing the inductance component by using a coreless substrate instead of the build-up substrate.SOLUTION: A mounting structure for a semiconductor device includes: a mounting substrate provided with an opening; a frame part provided at an edge part of the opening, and housed in the edge part; a frame-like member composed of a protrusion part protruded from the frame part; a coreless substrate arranged on the mounting substrate, and supported by the protrusion part of the frame-like member; and a semiconductor element arranged on the coreless substrate. |
