| 摘要 |
<p>A substrate firing device having an increased contact area between the substrate and substrate support portions, thereby preventing the substrate support portions from generating scratches on the substrate when the substrate expands and contracts due to heating and cooling. By increasing the contact area to the substrate and by using quartz on items that contact the substrate, it is possible to prevent scratches occurring on a substrate, even after an etching process of the substrate, thereby improving quality of the slimmer final product.</p> |
