SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

摘要

Provided is a semiconductor device mount structure obtained by connecting a first protrusion electrode [a bump (A5)] formed on a first electronic component [a substrate (2) or a semiconductor element (A1)] and a second protrusion electrode [a bump (B6)]formed on a second electronic component [a semiconductor element (B11)]. The first protrusion electrode and the second protrusion electrode are made of different metal materials. The first protrusion electrode is harder than the second protrusion electrode, has a head in an acute shape, and is fixed in the second protrusion electrode.