PRINTED CIRCUIT BOARD COMPOSITION, AND PRINTED CIRCUIT BOARD CONTAINING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board composition with excellent thermal characteristics, and a printed circuit board containing the same.SOLUTION: A printed circuit board composition having a low thermal expansion coefficient and high heat resistance comprises: 5-49 wt.% of a liquid crystal oligomer which includes, at least at one end, a functional group of the specified chemical formula E; 5-42 wt.% of an epoxy resin; and 14-90 wt.% of a filler. (In the chemical formula E, Z4 represents a substituted or unsubstituted C3-C30 heteroatom-containing alicyclic group, and n4 represents an integer of 0-3.)