发明名称 MICROMACHINED ULTRASONIC TRANSDUCER MODULE ARRAY
摘要 Disclosed is a micromachined ultrasonic transducer array. The disclosed micromachined ultrasonic transducer array includes an arrangement plate which is located on a printed circuit board, and a plurality of MUT modules which are arranged in a plurality of cavities on the arrangement plate and convex parts between adjacent cavities on the arrangement plate, respectively. The MUT module includes an ASIC arranged on the arrangement plate and an MUT arranged on the ASIC.
申请公布号 KR20140035204(A) 申请公布日期 2014.03.21
申请号 KR20120101804 申请日期 2012.09.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JEONG, BYUNG GIL
分类号 H04R17/00;A61B8/00;G01N29/24 主分类号 H04R17/00
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