发明名称 |
MICROMACHINED ULTRASONIC TRANSDUCER MODULE ARRAY |
摘要 |
Disclosed is a micromachined ultrasonic transducer array. The disclosed micromachined ultrasonic transducer array includes an arrangement plate which is located on a printed circuit board, and a plurality of MUT modules which are arranged in a plurality of cavities on the arrangement plate and convex parts between adjacent cavities on the arrangement plate, respectively. The MUT module includes an ASIC arranged on the arrangement plate and an MUT arranged on the ASIC. |
申请公布号 |
KR20140035204(A) |
申请公布日期 |
2014.03.21 |
申请号 |
KR20120101804 |
申请日期 |
2012.09.13 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JEONG, BYUNG GIL |
分类号 |
H04R17/00;A61B8/00;G01N29/24 |
主分类号 |
H04R17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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