| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire saw device with a reduced breakage ratio of a wire. SOLUTION: The wire saw device S1 includes the wire 3 having abrasive grains fixed to its surface, a slicing board 2 for adhering a workpiece disposed on the wire 3, a base plate 10 for holding the slicing board 2, a device fixing unit 11 for fixing the base plate 10 and a supply nozzle 4 for supplying a working fluid to a part to be cut of the workpiece 1. It has a protruding part where part of the slicing board 2, the base plate 10 or the device fixing unit 11 is located outside an end of the workpiece 1 in a running direction of the wire 3. A distance d from an interface e between the workpiece 1 and the slicing board 2 to the protruding part is specified to be a distance free from splash of the working fluid. COPYRIGHT: (C)2011,JPO&INPIT |
