| 摘要 |
<p>The present invention relates to a method of fabricating a flexible PCB and the flexible PCB thereof, and more particularly to a method of fabricating a flexible PCB and the flexible PCB thereof by transferring a conductive silver electrode including a silver electrode material formed through heat treatment at the temperature of 600°C or less to a flexible film on a heat-resistance substrate. In the flexible PCB fabricated according to the present invention, the silver electrode material can be provided in the form of a metallic bulk through the heat treatment at the temperature of 600°C or less. Accordingly, when comparing with a conventional copper film etching scheme, the same electric conductivity can be represented, the process steps can be more simplified, and the thin film can be formed. Therefore, the fabrication costs can be reduced, and the flexible PCB can be applied to a cellular phone having difficult conditions for thickness.</p> |
