发明名称 LOW INDUCTANCE FLEX BOND WITH LOW THERMAL RESISTANCE
摘要 <p>An electronic circuit having low inductance connections is disclosed. The electronic circuit comprises a ground plane and a flex circuit. The flex circuit has; a first plane which faces the ground plane generally; and a second plane which is an opposite side of the first plane. The flex circuit has a flexible bridge defined. The electronic circuit comprises; a first electronic device connected to a second surface of the flex circuit to be able to communicate; a second electronic device connected to the second surface of the flex circuit to be able to communicate; and one or more conductive traces which are defined on the second surface of the flex circuit and are extended along the flexible bridge. One end of the conductive traces is formed to receive an outbound current from the first electronic device. The other end of the conductive traces is connected to the second electronic device to be able to communicate through a vertical mutual connection access.</p>
申请公布号 KR20140056002(A) 申请公布日期 2014.05.09
申请号 KR20130126567 申请日期 2013.10.23
申请人 LSI CORPORATION 发明人 LATURELL DONALD R.;ABDELLI SAID E.;KISS PETER;MACDONALD JAMES F.;WILSON ROSS S.
分类号 H01L21/60 主分类号 H01L21/60
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