| 摘要 |
<p>Disclosed is a substrate processing device. The substrate processing device includes a chamber having an inner space; a substrate support unit which is located inside the chamber and supports a substrate; a first shower head which is located on the upper part of the substrate support unit and has distribution holes for distributing process gas; and a ring-shaped guide unit extended down from the lower edge part of the first shower head towards the substrate support unit.</p> |
