半导体组件、半导体元件及其制法,申请号TW099118671-传众专利搜索

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发明名称	半导体组件、半导体元件及其制法
摘要
申请公布号	TWI437677	申请公布日期	2014.05.11
申请号	TW099118671	申请日期	2010.06.09
申请人	台湾积体电路制造股份有限公司新竹市新竹科学工业园区力行六路8号	发明人	赖怡仁;韩至刚;詹前彬;简智源;杨怀德
分类号	H01L23/488;H01L21/60	主分类号	H01L23/488
代理机构		代理人	洪澄文台北市南港区三重路19之6号2楼;颜锦顺台北市南港区三重路19之6号2楼
主权项
地址	新竹市新竹科学工业园区力行六路8号

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