| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer sticking method capable of appropriately sticking a warped wafer.SOLUTION: A wafer sticking method comprises the steps of: detecting a surface shape of a wafer (W) (wafer warpage detection step); applying a photo-curable liquid resin (R) to a sheet (S) and positioning the wafer so that a prescribed surface corresponding to the sticking conditions set in a resin sticking device (2) is made to face the sheet and the liquid resin on the basis of the sticking conditions and the detected surface shape (wafer positioning step); and pressing the wafer against the liquid resin, spreading the liquid resin over the whole region in which the wafer and the sheet overlap with each other, and releasing the pressing of the wafer, and sticking the prescribed surface of the wafer to the sheet by curing the liquid resin by irradiating it with light (L) (wafer sticking step). |
