ADHESIVE COMPOSITION AND ADHESION METHOD THEREWITH, AND PEELING METHOD AFTER ADHESION

摘要

PROBLEM TO BE SOLVED: To provide an adhesive composition that is used, in semiconductor device manufacturing, in particular, in fabrication of through silicon electrodes (TSV), to adhere a silicon substrate to a support substrate followed by peeling thereof, allows rapid operation of the adhering and peeling and achieve adhesion force withstanding mechanical processes such as grinding.SOLUTION: In the method, adhering is conducted using an adhesive composition that contains cage silsesquioxane having a polymerizable group, a polymerization initiator, and an ultraviolet absorption foaming agent, followed by peeling. The polymerizable group is selected from the group consisting of an acryloyl group, methacryloyl group and vinyl group. The ultraviolet absorption foaming agent is diketone compound or diazonium salt. A silicon substrate and a glass substrate are adhered together. To achieve adhesion, the adhesive composition is irradiated with light having wave length of 300 to 900 nm to be cured thereby adhering the substrates together.