发明名称 接合基板の製造方法、接合基板
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a joint substrate easily achieving improvement of reliability and improvement of a manufacture yield, and a joint substrate. <P>SOLUTION: For a joint surface to be joined to a second substrate in a first substrate, hydrophilization treatment is performed (ST11). Then, by sticking the second substrate to the joint surface where the hydrophilization treatment is performed in the first substrate, the first substrate and the second substrate are temporarily joined by hydrogen bonding (ST21). Then, by performing heat treatment to the temporarily joined first substrate and second substrate, the first substrate and the second substrate are joined by covalent bonding (ST31). In the hydrophilization treatment, deuterated hydroxy group (OD group) is formed on respective joint surfaces of the first substrate and the second substrate. Along with that, surface adsorption water adsorbed to the respective joint surfaces of the first substrate and the second substrate is replaced with heavy water (D<SB POS="POST">2</SB>O). <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5614322(B2) 申请公布日期 2014.10.29
申请号 JP20110031184 申请日期 2011.02.16
申请人 发明人
分类号 C30B33/06;H01L21/02 主分类号 C30B33/06
代理机构 代理人
主权项
地址