| 摘要 |
PURPOSE:To obtain a polyimide resin excellent in long-term heat resistance and moldability, by heat-curing a specified oligoimide in the presence of a polyallyl compound and/or its oligomer. CONSTITUTION:An oligoamic acid as a precursor is obtained by reacting an aromatic tetracarboxylic acid (anhydride) with an aromatic amine and a compound which can give an addition-polymerizable group in the presence of a polar solvent (e.g., dimethylformamide). The obtained precursor is cyclized to obtain an oligoimide having aromatic imido bonds in the main chain and at least two addition-polymerizable groups of formulas I and II (wherein R1-2 are each H or a lower alkyl) in the terminals and/or the side chains. 20-1pt.wt. this oligoimide is heat-cured in the presence of 1pt.wt. polyallyl compound (MW<=800) of formula III or IV (wherein R10-12 are each R1), having an (iso)cyanuric ring in the molecule and being mutually soluble with said oligoimide and/or its oligomer to obtain a polyimide of a glass transition point >=280 deg.C.
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