发明名称 SUBSTRATE TRANSFER APPARATUS, AND SUBSTRATE TRANSFER METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate transfer apparatus capable of obtaining a high throughput, and to provide a substrate transfer method using the same.SOLUTION: A substrate transfer apparatus 100 includes an atmosphere conveyance section 1, first transfer means 2 provided in the atmosphere conveyance section 1, an airtight transfer chamber 3 coupled with the atmosphere conveyance section 1, and second transfer means 4 provided in the airtight transfer chamber 3. The first transfer means 2 includes a substrate housing section 21 capable of housing a plurality of substrates, an alignment section 22 for positioning the substrate, and an atmosphere conveyance mechanism 23 capable of transferring the substrate housed in the substrate housing section 21 to the alignment section 22, and capable of transferring the substrate subjected to positioning by the alignment section 22 to the airtight transfer chamber 3. The second transfer means 4 includes a movable holding section 41 having two substrate holding sections 42 located at both ends while holding a rotating shaft therebetween. The movable holding section 41 can advance and retract in the coupling direction of the airtight transfer chamber 3 and a chamber C.
申请公布号 JP2014236193(A) 申请公布日期 2014.12.15
申请号 JP20130119033 申请日期 2013.06.05
申请人 SPP TECHNOLOGIES CO LTD 发明人 UCHIDA RYOHEI;HAYASHI YASUYUKI;HAYAMA NOBORU
分类号 H01L21/677;B65G49/07;H01L21/205;H01L21/3065;H01L21/31 主分类号 H01L21/677
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