| 摘要 |
PROBLEM TO BE SOLVED: To suppress warpage of a package, resulting from heat stress in a molded package having a half mold structure.SOLUTION: A molded package comprises: a substrate 10 having one face 11 and the other face 12, one as a surface and the other as a back; electronic components 20, 21 mounted on the one face 11 of the substrate 10; and mold resin 30 provided on the one face 11 and used for sealing the one face 11 together with the electronic components 20, 21. The other face 12 of the substrate 10 is exposed from the mold resin 30. In the mold resin 30 and on the one face 11 of the substrate 10, a warpage suppressing projection 40, projecting higher than the electronic components 20, 21, is provided for suppressing warpage of the substrate 10 and mold resin 30 due to heat stress of the mold resin 30, by thinning the mold resin 30 on the leading end of the projection. The warpage suppressing projection 40 is smaller in the coefficient of linear expansion and higher in the coefficient of elasticity than the mold resin 30. |
