发明名称 SUBSTRATE INSPECTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate inspection method for carrying out inspection efficiently at low cost when inspecting a substrate having a number of electrode pads on one side of the substrate and a few common electrode pads on the other side.SOLUTION: A unit substrate is held, while electrical inspection is carried out, between a first inspection jig not provided with a probe for connecting with an electrode pad to establish electrical continuity and corresponding to the other surface of a sheet substrate and a second inspection jig corresponding to one surface of the unit substrate. After the inspection of the unit substrate by the first and second inspection jigs is finished, the inspection jigs are replaced with a third injection jig provided with a probe for connecting, to establish electrical continuity, with an electrode pad on the one surface of the unit substrate of a wiring pattern having electrical continuity from the electrode pad on the one surface of the unit substrate to the electrode pad on the other surface, and replaced with a fourth inspection jig provided with a probe for connecting, to establish electrical continuity, with the electrode pad electrically connected via the wiring pattern to the probe of the third inspection jig before electrical inspection is carried out.</p>
申请公布号 JP2014235111(A) 申请公布日期 2014.12.15
申请号 JP20130117745 申请日期 2013.06.04
申请人 NIDEC-READ CORP 发明人 YAMASHITA MUNEHIRO;FUJINO MAKOTO
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
代理机构 代理人
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