| 摘要 |
Disclosed is a substrate cleaning method that washes the back of the substrate without reversing the substrate so as not to damage the fringe part of the substrate. The substrate cleaning apparatus 1 has two substrate holding means (adsorption pad 2 and spin chuck 3) to support the substrate in the state to turn the back downward from the back and to hold. The two substrate holding means shift the substrate between these substrate holding means while preventing the supported area from lapping over. The washing member (brush 5) washes the backs of the substrate other than the area supported by the substrate holding means and washes the entire back of the substrate by shifting the substrate between two substrate holding means. |
