| 摘要 |
PROBLEM TO BE SOLVED: To relax thermal stress occurring at a semiconductor chip while properly assuring jointing property and heat dispersion property even under a high-temperature environment, relating to a semiconductor device in which a substrate is jointed to a semiconductor element through a jointing member.SOLUTION: A jointing member 30 is interposed between one surface 11 of a substrate 10 and a semiconductor chip 20. The semiconductor chip 20 has a temperature distribution in the chip because of a heating during driving. In the semiconductor chip 20, a high temperature portion in the temperature distribution is assumed as a first portion 23 and a low temperature portion of a remaining part other than the first portion 23 is assumed as a second portion 24. The jointing member 30 includes a first jointing member 31 positioned directly under the first portion 23 and a second jointing member 32 positioned directly under the second portion 24. The first joint member 31 has a higher melting point and a higher heat conductance property than the second jointing member 32, and the second jointing member 32 has a lower melting point and a lower elasticity than the first jointing member 31. |
