| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and a method of manufacturing the semiconductor package.SOLUTION: A package element has an insulation layer 21, and a plurality of holes 22 are disposed on a first surface of the insulation layer 21. Furthermore, a plurality of package traces are embedded into the insulation layer 21 and connected to the other ends of the holes 22. The holes 22 provide a positioning function for connecting solder balls to the package traces, and a signal of a semiconductor chip 31 is connected to the package traces via a conductor of the chip and also the signal is transmitted to the outside via the solder balls. The elastic modulus of the material of the insulation layer 21 is preferably larger than 1.0 GPa. |
